Company Filing History:
Years Active: 2010-2011
Title: Sabine Nieland: Innovator in Semiconductor Technology
Introduction
Sabine Nieland is a prominent inventor based in Gotha, Germany. She has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase her innovative approaches to chip bonding and contact-connecting methods.
Latest Patents
Her latest patents include a "Method and arrangement for contact-connecting semiconductor chips on a metallic substrate." This method involves several steps, including prepatterning a one-piece basic substrate into regions for future modules, contact-connecting semiconductor chip pads in predetermined areas, and applying adhesive layers for effective bonding. Another notable patent is the "Method and device for contacting semiconductor chips," which enhances productivity in chip bonding processes. This invention utilizes flip-chip bonding techniques to create contacting regions on substrates, ensuring efficient underfilling and removal of supporting modules.
Career Highlights
Sabine Nieland has established herself as a key figure in her field through her innovative work at Assa Abloy AB. Her expertise in semiconductor technology has led to advancements that improve the efficiency and effectiveness of chip bonding processes.
Collaborations
She has collaborated with notable colleagues, including Manfred Michalk and Martin Michalk, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Sabine Nieland's contributions to semiconductor technology through her patents and collaborative efforts highlight her role as a leading inventor in the industry. Her work continues to influence advancements in chip bonding methods, showcasing her commitment to innovation.