The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Feb. 17, 2006
Manfred Michalk, Erfurt, DE;
Sabine Nieland, Gotha, DE;
Martin Michalk, Leipzig, DE;
Assa Abloy AB, Stockholm, SE;
Abstract
The method comprises the following steps: the substrate in the form of a one-piece basic substrate () is prepatterned into regions corresponding to future modules, pads of the semiconductor chip () are then contact-connected in predetermined regions of a first area of the basic substrate () and on the top side () of the prepatterned basic substrate () and on one area side of the semiconductor chip () a first adhesive layer () is applied, a second adhesive layer () is subsequently applied to the other area side of the semiconductor chip (), and a curing of the adhesive layers () and a final patterning of the metallic basic substrate () are then effected.