The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Aug. 28, 2004
Martin Michalk, Erfurt, DE;
Manfred Michalk, Erfurt, DE;
Sabine Nieland, Gotha, DE;
Assa Abloy AB, Stockholm, SE;
Abstract
The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips () on a metallic substrate (), whereby an etch resist () is located at least on one substrate side, and semiconductor chips () are contacted on the contacting side () by means of flip-chip bonding processes, during which a contacting region () is created on the contacting side () of the substrate (). A semiconductor chip () having two contact bumps () is contacted on said contacting region in such a manner that: a contact bump () is contacted on both sides of a structure line () or of a structure trench () dividing the contacting region (), and; after the contacting, an underfilling of the chip () ensues after which an electrically insulating passage () is made in the contacting region (), and a module (), which supports the semiconductor chip (), is removed from the substrate ().