S C Chang

Title: S C Chang: Innovator in Molded Plastic Packaging Technology

Introduction

S C Chang is a notable inventor based in Riverbank, California, recognized for his contributions to semiconductor packaging technology. With a focus on enhancing electrical performance, his work has led to significant advancements in the field.

Latest Patents

S C Chang holds a patent for a "Molded plastic package with heat sink and enhanced electrical performance." This innovative design incorporates a molded plastic package for semiconductor devices that features a heat sink, controlled impedance leads, and separate power and ground rings. The lead frame of the package is separated by a dielectric layer and is attached to a metal heat sink. This design includes multiple rings for power and ground connections, allowing for improved electrical performance. The die is directly attached to the heat sink through a window on the dielectric, facilitating high power dissipation. The package is molded using conventional materials and equipment, making it a practical solution for modern semiconductor applications.

Career Highlights

S C Chang is currently employed at A-Sat Corporation, where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in developing solutions that meet the growing demands of the electronics industry.

Collaborations

Throughout his career, S C Chang has collaborated with talented professionals, including Marcos Karnezos and Edward G Combs. These partnerships have contributed to the successful development of advanced packaging technologies.

Conclusion

S C Chang's innovative work in molded plastic packaging has made a significant impact on the semiconductor industry. His patent reflects a commitment to enhancing electrical performance and efficiency in electronic devices.