A-sat Corporation

S C Chang

Edward G Combs

Marcos Karnezos

John R Fahey

A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated by a dielectric layer, is attached to a metal heat sink. It has more than one ring for power and ground connections. The die itself is attached directly onto the heat sink through a window on the dielectric and provides high power dissipation. The package is molded using conventional materials and equipment.

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Riverbank, CA, United States of America

S C Chang