Osaka, Japan

Ryuichi Otogawa

This inventor holds 2 USPTO granted patents and 2 EPO patents. Top assignees: Daiso Co., Ltd., Bridgestone Corporation. Active years: 2011-2012.


% Patents Active = 50.0


Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2011-2012

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2 patents (USPTO):Explore Patents

Title: Ryuichi Otogawa: Innovator in Metal Wire Electroplating

Introduction

Ryuichi Otogawa is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electroplating, particularly in the development of innovative anode technologies. With a total of 2 patents to his name, Otogawa's work has the potential to enhance the efficiency and effectiveness of metal wire electroplating processes.

Latest Patents

Otogawa's latest patents include an "Insoluble Anode for Metal Wire Electroplating and Method of Electroplating Metal Wire Using the Same." This invention addresses the need for a stable and uniform electroplating process for multiple metal wires simultaneously. The design features a series of insoluble electrode plates arranged in parallel, which sandwich the wire travel paths. This configuration allows for consistent electroplating amounts over extended periods. Additionally, the anode is designed to be economical and long-lasting, maintaining its function even in high-consumption areas.

Career Highlights

Throughout his career, Ryuichi Otogawa has worked with prominent companies such as Daiso Co., Ltd. and Bridgestone Corporation. His experience in these organizations has contributed to his expertise in electroplating technologies and innovation.

Collaborations

Otogawa has collaborated with notable colleagues, including Kumiko Ohara and Takashi Onishi. These partnerships have likely fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Ryuichi Otogawa's contributions to the field of electroplating through his innovative patents demonstrate his commitment to advancing technology. His work not only enhances the efficiency of metal wire electroplating but also sets a foundation for future innovations in the industry.

Profile summary based on public USPTO records.
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