Daiso Co., Ltd.

Bridgestone Corporation

Ryuichi Otogawa

Kenji Kawaguchi

Takashi Onishi

Kenichi Murakami

Kumiko Ohara

Yuji Nakamura

An insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates are disposed in a parallel alignment to be placed sandwiching a plurality of wire travel paths from both sides. A plurality of the insoluble electrode plates are tightened and fixed by through-bolts at a plurality of places along the travel path direction. A conductive spacer is interposed in each gap between the insoluble electrode plates at a tightening part by the through-bolt and also a conductive member is provided so as to contact all the electrode plates and the conductive spacers.

Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same

Provided is an economical long-life insoluble anode capable of maintaining an anode function stably for a long time even if it is used in a part where severe consumption occurs to generate a cathodizing phenomenon, and also capable of reducing the amount of an electrocatalyst used as much as possible. To realize this, on the surface of a metal substratecomposed of a titanium plate, a porous layerincluding a sintered body of a spherical titanium powder is formed as a base layer. An electrocatalyst layeris formed from the surface of the porous layerto its inside. A part of the electrocatalyst penetrates into the porous layer, which provides an incomparably stronger anchor effect than the case of a blast treatment. Even when parts exposed from the porous layerare peeled off and dropped off, the anode function is maintained by the electrocatalyst left in the porous layer

Insoluble electrode

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Osaka, Japan

Ryuichi Otogawa