The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Jun. 29, 2007
Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same
Kenji Kawaguchi, Osaka, JP;
Ryuichi Otogawa, Osaka, JP;
Kenichi Murakami, Saga, JP;
Yuji Nakamura, Saga, JP;
Kenji Kawaguchi, Osaka, JP;
Ryuichi Otogawa, Osaka, JP;
Kenichi Murakami, Saga, JP;
Yuji Nakamura, Saga, JP;
Daiso Co., Ltd., Osaka-shi, JP;
Bridgestone Corporation, Tokyo, JP;
Abstract
An insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates are disposed in a parallel alignment to be placed sandwiching a plurality of wire travel paths from both sides. A plurality of the insoluble electrode plates are tightened and fixed by through-bolts at a plurality of places along the travel path direction. A conductive spacer is interposed in each gap between the insoluble electrode plates at a tightening part by the through-bolt and also a conductive member is provided so as to contact all the electrode plates and the conductive spacers.