Saga, Japan

Kenichi Murakami

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Bridgestone Corporation, Daiso Co., Ltd.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Murakami. Retrieved from https://idiyas.com/inventor/kenichi-murakami-m4bfuw3x

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Kenichi Murakami: Innovator in Metal Wire Electroplating

Introduction

Kenichi Murakami is a notable inventor based in Saga, Japan. He has made significant contributions to the field of electroplating, particularly with his innovative approach to metal wire electroplating. His work has implications for various industries that rely on metal wire applications.

Latest Patents

Murakami holds a patent for an "Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same." This invention provides an insoluble anode capable of simultaneously electroplating multiple metal wires while ensuring uniform electroplating amounts over extended periods. The design features a series of insoluble electrode plates arranged in parallel, which sandwich the wire travel paths. These plates are secured with through-bolts, and conductive spacers are placed in the gaps to enhance conductivity.

Career Highlights

Throughout his career, Kenichi Murakami has worked with prominent companies such as Daiso Co., Ltd. and Bridgestone Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electroplating technology.

Collaborations

Murakami has collaborated with notable colleagues, including Kenji Kawaguchi and Ryuichi Otogawa. These partnerships have fostered innovation and development in their respective fields.

Conclusion

Kenichi Murakami's contributions to metal wire electroplating demonstrate his innovative spirit and technical expertise. His patent reflects a significant advancement in the industry, showcasing his ability to solve complex problems effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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