Saga, Japan

Yuji Nakamura

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Bridgestone Corporation, Daiso Co., Ltd.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuji Nakamura. Retrieved from https://idiyas.com/inventor/yuji-nakamura-smcgclap

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Yuji Nakamura: Innovator in Metal Wire Electroplating

Introduction

Yuji Nakamura is a notable inventor based in Saga, Japan. He has made significant contributions to the field of electroplating, particularly with his innovative approach to metal wire electroplating. His work has implications for various industries that rely on metal wire applications.

Latest Patents

Nakamura holds a patent for an "Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same." This invention features an insoluble anode that allows for the simultaneous electroplating of multiple metal wires while ensuring uniform electroplating amounts over extended periods. The design includes a series of insoluble electrode plates arranged in parallel, which sandwich the wire travel paths. These plates are secured with through-bolts, and conductive spacers are placed in the gaps to enhance conductivity.

Career Highlights

Throughout his career, Yuji Nakamura has worked with prominent companies such as Daiso Co., Ltd. and Bridgestone Corporation. His experience in these organizations has contributed to his expertise in electroplating technologies and innovations.

Collaborations

Nakamura has collaborated with notable colleagues, including Kenji Kawaguchi and Ryuichi Otogawa. Their combined efforts have further advanced the field of electroplating and contributed to the development of new technologies.

Conclusion

Yuji Nakamura's contributions to the field of metal wire electroplating demonstrate his innovative spirit and technical expertise. His patent and career achievements reflect his commitment to advancing electroplating technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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