Ryota Tanaka

Title: Ryota Tanaka - Innovator in Packaging Technology

Introduction: Ryota Tanaka is an accomplished inventor based in Tokyo, Japan. He is currently employed at Toppan Inc., where he focuses on developing innovative packaging solutions. Despite having no granted patents to his name, his contributions to the field of packaging technology are noteworthy.

Latest Patent Applications: Ryota Tanaka has submitted several patent applications that showcase his expertise. One of his latest applications is for a laminated body, packaging material, and packaging body. This invention features a structure where a substrate layer and a sealant layer are laminated in a specific order. The substrate layer and the sealant layer include polyethylene, with the substrate layer exhibiting machine direction elongation rates of 0.5 to 3.0% at 70° C and 2.0 to 5.0% at 90° C when a tension of 50 N/m is applied. Additionally, the tensile elastic modulus of the substrate layer in the machine direction ranges from 800 to 2000 MPa at 23° C. Another application involves a laminate, package, and packaged article, which is primarily made of polyethylene and demonstrates excellent heat resistance. This laminate consists of a substrate layer, an adhesive agent layer, and a sealant layer, with the substrate layer having a probe descendent temperature of 180° C or higher.

Conclusion: Ryota Tanaka is a dedicated inventor whose work at Toppan Inc. reflects his commitment to advancing packaging technology. His latest patent applications highlight his innovative approach to creating effective and efficient packaging solutions.