The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Jan. 27, 2022
Applicant:

Toppan Inc., Tokyo, JP;

Inventors:

Ryota Tanaka, Tokyo, JP;

Ayumi Tanaka, Tokyo, JP;

Takeshi Nishikawa, Tokyo, JP;

Assignee:

TOPPAN INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 7/028 (2019.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 7/028 (2019.01); B32B 27/08 (2013.01); B32B 2250/03 (2013.01); B32B 2250/242 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2307/308 (2013.01); B32B 2307/31 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/736 (2013.01); B32B 2439/46 (2013.01);
Abstract

A laminate including a first base material layer, a second base material layer, and a sealant layer in this order, wherein all three layers include a polyolefin film; the polyolefin film of the first base material layer or the second base material layer includes an inorganic oxide layer on at least one surface thereof; and each of the first base material layer, the second base material layer, and the sealant layer has a heat shrinkage rate, in a travel direction after heating at 120° C. for 15 minutes, which satisfies the following inequalities: heat shrinkage rate of the second base material layer≤5% (Inequality 1); heat shrinkage rate of the second base material layer≥heat shrinkage rate of the first base material layer (Inequality 2); and, heat shrinkage rate of the second base material layer≥heat shrinkage rate of the sealant layer (Inequality 3).


Find Patent Forward Citations

Tanaka, Ryota. (2025). Laminate and packaging bag (U.S. Patent No. 12502877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12502877

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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