This inventor holds 4 USPTO granted patents and 6 published patent applications. Top assignee: Denka Company Limited. Active years: 2022-2026.
Location History:
- Isesaki, JP (2022)
- Tokyo, JP (2023)
Company Filing History:
Years Active: 2022-2026
Title: Ryosuke Yanaka: Innovator in Electronic Packaging Solutions
Introduction
Ryosuke Yanaka is a prominent inventor based in Isesaki, Japan. He has made significant contributions to the field of electronic packaging, holding a total of 4 patents. His innovative work focuses on developing advanced materials and methods for packaging electronic components.
Latest Patents
One of Ryosuke Yanaka's latest patents is for a sheet designed for packaging electronic parts. This electronic device packaging sheet includes a substrate sheet that has at least one substrate layer made of a thermoplastic resin and a resin that contains copolymers. The specific copolymers are selected from a (meth)acrylic acid alkyl ester copolymer and a styrene-acrylonitrile copolymer, with a weight-average molecular weight ranging from 700,000 to 4,300,000. The substrate sheet comprises the thermoplastic resin at 70-99 mass % and the resin at 1-30 mass %.
Another notable patent involves a layered sheet, container, carrier tape, and electronic component packaging body. This layered sheet consists of a substrate layer and surface layers that are configured to be layered on at least one surface of the substrate layer. The substrate layer contains a first thermoplastic resin and inorganic fillers, while the surface layers contain a second thermoplastic resin and a conductive material. The content of the inorganic fillers in the substrate layer is maintained at 0.3 to 28 mass % based on the total amount of the substrate layer.
Career Highlights
Ryosuke Yanaka is currently employed at Denka Company Limited, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in packaging electronic components, ensuring their safety and reliability.
Collaborations
Throughout his career, Ryosuke has collaborated with notable colleagues, including Junpei Fujiwara and Takeshi Saito. These collaborations have contributed to the development of cutting-edge packaging solutions.
Conclusion
Ryosuke Yanaka is a key figure in the realm of electronic packaging, with a focus on innovative materials and methods. His contributions through his patents reflect his commitment to enhancing the safety and efficiency of electronic components.