The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Dec. 14, 2021
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/30 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 2250/24 (2013.01); B32B 2250/42 (2013.01); B32B 2250/44 (2013.01); B32B 2307/7376 (2023.05); B32B 2553/00 (2013.01);
Abstract
An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer comprising the thermoplastic resin (I) at 70-99 mass % and the resin (II) at 1-30 mass %.