This inventor holds 1 USPTO granted patent and 6 published patent applications and 1 EPO patent. Top assignee: Denka Company Limited. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Ikuka Inoda: Innovator in Electronic Device Packaging
Introduction
Ikuka Inoda is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic device packaging. His innovative approach has led to the development of a unique packaging solution that enhances the protection of electronic components.
Latest Patents
Ikuka Inoda holds a patent for a "Sheet for packaging electronic part." This invention includes an electronic device packaging sheet that comprises a substrate sheet with at least one substrate layer. The substrate layer consists of a thermoplastic resin (I) and a resin (II), which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B). The weight-average molecular weight of these copolymers ranges from 700,000 to 4,300,000. The substrate sheet is designed with a composition of thermoplastic resin (I) at 70-99 mass % and resin (II) at 1-30 mass %.
Career Highlights
Ikuka Inoda is associated with Denka Company Limited, where he has been instrumental in advancing packaging technologies. His work focuses on creating materials that provide superior protection for electronic devices, ensuring their reliability and longevity.
Collaborations
Ikuka Inoda collaborates with Takeshi Saito, a fellow innovator in the field. Their combined expertise contributes to the development of cutting-edge packaging solutions.
Conclusion
Ikuka Inoda's contributions to electronic device packaging demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in the industry, showcasing the importance of protective materials in technology.