The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Mar. 08, 2021
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/20 (2006.01); B32B 27/08 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2260/046 (2013.01); B32B 2264/108 (2013.01); B32B 2305/30 (2013.01); B32B 2313/04 (2013.01); B32B 2398/20 (2013.01); B32B 2439/02 (2013.01);
Abstract
A layered sheetincludes a substrate layer, and surface layersandconfigured to be layered on at least one surface of the substrate layer. The substrate layercontains a first thermoplastic resin and inorganic fillers. The surface layersandcontain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layeris 0.3 to 28 mass % based on a total amount of the substrate layer.