Company Filing History:
Years Active: 2017-2018
Title: Innovations by Ryosuke Nishihara
Introduction
Ryosuke Nishihara is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology. With a total of 2 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
Nishihara's latest patents include a method of processing a wafer and a wafer processing method. The first patent describes a method for processing a wafer that has a device area with multiple devices formed within it. This method involves a grinding step that utilizes a grinding wheel smaller in diameter than the wafer. This process results in a first portion corresponding to the device area and an annular second portion that is thicker and more protrusive. The angle formed between the reverse side of the first portion and the inner side surface of the annular second portion is maintained between 45° and 75°. The second patent outlines a wafer processing method that consists of two grinding steps. The first step involves moving first grinding abrasives in a direction orthogonal to the holding surface of a chuck table, creating a first circular recess in the back surface of the wafer. The second step employs finer abrasive grains that are moved in an oblique direction to further refine the first circular recess.
Career Highlights
Ryosuke Nishihara is currently employed at Disco Corporation, where he continues to innovate in wafer processing technologies. His work has been instrumental in advancing the efficiency and effectiveness of wafer manufacturing processes.
Collaborations
Nishihara has collaborated with notable coworkers such as Kohei Tsujimoto and Minoru Matsuzawa. Their combined expertise has contributed to the development of cutting-edge technologies in the field.
Conclusion
Ryosuke Nishihara's contributions to wafer processing technology through his patents and collaborations highlight his role as a significant inventor in the industry. His innovative methods continue to shape the future of wafer manufacturing.