Ryan W Rieger

Title: Innovations by Ryan W Rieger

Introduction

Ryan W Rieger is an accomplished inventor based in Brooklyn Center, MN (US). He has made significant contributions to the field of technology, particularly in sensor assembly methods. With a total of 5 patents to his name, Rieger continues to push the boundaries of innovation.

Latest Patents

One of Rieger's latest patents is a vertical sensor assembly method. This method provides a way to vertically bond a chip to a substrate. It involves forming a metal bar with a linear aspect on the substrate, applying a solder paste layer to create a solder bar, and forming multiple metal pads on the substrate. Each solder pad is strategically offset from the solder bar, allowing for precise alignment of the chip to be bonded. Another notable patent involves systems and methods for three-dimensional sensors. This patent outlines a process for fabricating a multi-axis sensor, which includes aligning dies with active surfaces and establishing electrical connections.

Career Highlights

Rieger is currently employed at Honeywell International Inc., where he applies his expertise in sensor technology. His work has been instrumental in developing advanced sensor systems that enhance various applications.

Collaborations

Throughout his career, Rieger has collaborated with talented individuals such as Hong Wan and Lakshman Withanawasam. These partnerships have contributed to the successful development of innovative technologies.

Conclusion

Ryan W Rieger is a notable inventor whose work in sensor technology has led to multiple patents and advancements in the field. His contributions continue to shape the future of innovation in technology.