The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2009

Filed:

Oct. 23, 2007
Applicants:

Ryan W. Rieger, Brooklyn Center, MN (US);

Hong Wan, Plymouth, MN (US);

Andrzej Peczalski, Eden Prairie, MN (US);

Inventors:

Ryan W. Rieger, Brooklyn Center, MN (US);

Hong Wan, Plymouth, MN (US);

Andrzej Peczalski, Eden Prairie, MN (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-axis magnetic or other field sensing device and method of fabricating a multi-axis magnetic or other field sensing device. An example sensing device is a 3-axis sensor package on a substrate with sensors on opposing sides of the substrate. One side of the substrate includes an X-axis sensor and a Y-axis sensor (or alternatively an integrated X-Y-axis sensor) and the opposite side of the substrate includes a Z-axis sensor on at least one sloped surface, the surface sloped with respect to both the first and second surface areas. One surface is mechanically and electrically bonded to a circuit board via conductive bumps. The other surface electrically connects to the circuit board through bonded wires and/or vias formed through the substrate.


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