Honeywell International Inc.

Ryan W Rieger

Hong Wan

Lakshman Withanawasam

Andrzej Peczalski

Bharat B Pant

Ronald James Jensen

Michael J Bohlinger

Michael L Freeman

A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.

Vertical sensor assembly method

Systems and methods for fabricating a multi-axis sensor are provided. In one implementation, a method comprises: fabricating a first die having a first active surface with first application electronics; fabricating a second die having a second active surface with second application electronics and a plurality of electrical connections that extend from the second application electronics to a side surface interface of the second die that is adjacent to the second active surface; aligning the side surface interface to be coplanar with the first active surface; and forming at least one electrical connection between the plurality of electrical connections and the first active surface.

Systems and methods for three dimensional sensors

Systems and methods for three-axis sensor chip packages are provided. In one embodiment, a directional sensor package comprises: a base; a first sensor die mounted to the base, the first sensor die having a first active sensor circuit and a first plurality of metal pads electrically coupled to the first active sensor circuit; a second sensor die mounted to the base, the second sensor die having a second active sensor circuit located on a first surface, and a second plurality of metal pads electrically coupled to the second active sensor circuit located on a second surface. The second sensor die is positioned such that the second active sensor circuit is oriented orthogonally with respect to the first active sensor circuit region and is perpendicular to the base. The second surface is adjacent to the first surface and angled with respect to a plane of the first surface.

Systems and methods for three-axis sensor chip packages

A multi-axis magnetic or other field sensing device and method of fabricating a multi-axis magnetic or other field sensing device. An example sensing device is a 3-axis sensor package on a substrate with sensors on opposing sides of the substrate. One side of the substrate includes an X-axis sensor and a Y-axis sensor (or alternatively an integrated X-Y-axis sensor) and the opposite side of the substrate includes a Z-axis sensor on at least one sloped surface, the surface sloped with respect to both the first and second surface areas. One surface is mechanically and electrically bonded to a circuit board via conductive bumps. The other surface electrically connects to the circuit board through bonded wires and/or vias formed through the substrate.

Integrated 3-axis field sensor and fabrication methods

Systems and methods for determining linear position are disclosed. An example system includes a magnet with first and second magnetic poles. The first and second magnetic poles define an axis of the magnet. The system also includes a magnetoresistive sensor comprising a magnetoresistive sensor structure. The magnetoresistive sensor structure defines a plane that, in the system, is oriented out-of-plane with the axis of the magnet. In operation, the magnet travels, with respect to the magnetoresistive sensor, along a substantially linear path of travel that is substantially parallel to the plane defined by the sensor structure, such that the sensor operates in a saturation mode when the magnet is located along a given portion of the path of travel. When operating in the saturation mode, the magnetoresistive sensor produces an electrical signal that corresponds with a linear position of the magnet along the given portion of the path of travel.

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Brooklyn Center, MN, United States of America

Ryan W Rieger