This inventor holds 3 USPTO granted patents. Top assignee: Lockheed Martin Corporation. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: The Innovative Contributions of Ryan S. Riegle
Introduction
Ryan S. Riegle is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of technology, particularly in semiconductor packaging and data storage solutions. With a total of 3 patents to his name, Riegle's work reflects a commitment to enhancing the reliability and durability of electronic components.
Latest Patents
Riegle's latest patents include the "Enhanced Reliability Semiconductor Package" and the "Rugged Hard Disk Drive Storage Assembly." The Enhanced Reliability Semiconductor Package patent discloses a method of packaging a semiconductor component with a printed wiring board. This method involves determining a first distance, applying a thin film onto the surface of the semiconductor component, and positioning the thin film adjacent to a solder pad on the printed wiring board.
The Rugged Hard Disk Drive Storage Assembly patent describes an enclosure capable of containing multiple hard disk drives. This assembly includes shock and vibration absorbers designed to protect the hard disk drives from damage in harsh environments. The enclosure is hermetically sealed, ensuring that the hard disk drives are isolated from external conditions, which is crucial for maintaining data integrity.
Career Highlights
Ryan S. Riegle is currently employed at Lockheed Martin Corporation, where he continues to innovate and develop advanced technologies. His work at Lockheed Martin has positioned him as a key player in the field of aerospace and defense technology.
Collaborations
Riegle has collaborated with notable colleagues, including William E. Murphy and Richard Shields. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Ryan S. Riegle's contributions to the fields of semiconductor packaging and data storage are noteworthy. His innovative patents demonstrate a dedication to improving technology for various applications. Riegle's work continues to influence the industry and showcases the importance of innovation in engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile