The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Jan. 10, 2005
William E. Murphy, Vestal, NY (US);
Ryan S. Riegle, Endicott, NY (US);
Richard Shields, Endwell, NY (US);
David L. Vos, Apalachin, NY (US);
William E. Murphy, Vestal, NY (US);
Ryan S. Riegle, Endicott, NY (US);
Richard Shields, Endwell, NY (US);
David L. Vos, Apalachin, NY (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.