Company Filing History:
Years Active: 2020-2022
Title: Rung-Jeng Lin: Innovator in Electronic Packaging
Introduction
Rung-Jeng Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 5 patents. His innovative approaches have led to advancements in the design and manufacturing of electronic components.
Latest Patents
Rung-Jeng Lin's latest patents include a package stack structure and a method for manufacturing the same. This method is characterized by stacking coreless circuit portions on the board of an electronic component, which reduces the overall thickness of the package stack structure. Another notable patent is an electronic package and a method for fabricating the same. This method involves stacking an antenna board on a circuit board, with a supporting body placed between them to maintain a consistent distance during the packaging process. This innovation ensures proper operation of the antenna board and improves product yield.
Career Highlights
Rung-Jeng Lin is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company in the semiconductor industry has allowed him to develop and refine his innovative ideas in electronic packaging.
Collaborations
Some of his notable coworkers include Han-Hung Chen and Chang-Fu Lin. Their collaborative efforts contribute to the advancement of technology in their field.
Conclusion
Rung-Jeng Lin's contributions to electronic packaging through his patents and work at Siliconware Precision Industries Co., Ltd. highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of electronic components.