The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

May. 30, 2018
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Han-Hung Chen, Taichung, TW;

Chun-Yi Huang, Taichung, TW;

Chang-Fu Lin, Taichung, TW;

Rung-Jeng Lin, Taichung, TW;

Kuo-Hua Yu, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01Q 1/2283 (2013.01); H05K 1/0243 (2013.01); H05K 1/112 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/368 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.


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