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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10756438 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

May. 30, 2018

Electronic package and method for fabricating the same

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Han-Hung Chen, Taichung, TW;

Chun-Yi Huang, Taichung, TW;

Chang-Fu Lin, Taichung, TW;

Rung-Jeng Lin, Taichung, TW;

Kuo-Hua Yu, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Hoang V Nguyen

Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01Q 1/2283 (2013.01); H05K 1/0243 (2013.01); H05K 1/112 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/368 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

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Quick Actions:

Chen, Han-Hung. (2020). Electronic package and method for fabricating the same (U.S. Patent No. 10756438). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10756438

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