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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11380978 B1

PDFFull Text
Date of Patent:
Jul. 05, 2022

Filed:

Apr. 24, 2018

Electronic package and method for fabricating the same

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Shi-Min Zhou, Taichung, TW;

Han-Hung Chen, Taichung, TW;

Rung-Jeng Lin, Taichung, TW;

Kuo-Hua Yu, Taichung, TW;

Chang-Fu Lin, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorney:

Hsuanyeh Law Group PC

Primary Examiner:

Hai V Tran

Assistant Examiner:

Bamidele A Jegede

Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01Q 1/22 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 3/341 (2013.01); H05K 3/368 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H05K 1/0243 (2013.01); H05K 2201/042 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2036 (2013.01);
Abstract

An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

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Quick Actions:

Zhou, Shi-Min. (2022). Electronic package and method for fabricating the same (U.S. Patent No. 11380978). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11380978

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