Rui Zhang

Title: Rui Zhang: Innovator in Integrated Circuit Technology

Introduction

Rui Zhang is a prominent inventor based in Gilbert, AZ (US), known for his contributions to integrated circuit technology. With a total of 11 patents to his name, he has made significant advancements in the field.

Latest Patents

One of Rui Zhang's latest patents is titled "Bridge interconnection with layered interconnect structures." This patent focuses on techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, the apparatus includes a substrate and a bridge embedded in the substrate, which is configured to route electrical signals between two dies. The interconnect structure, electrically coupled with the bridge, features a via structure made of a first conductive material, a barrier layer with a second conductive material, and a solderable material with a third conductive material. Each of these materials has a different chemical composition, showcasing the innovative approach taken in this invention.

Career Highlights

Rui Zhang has worked with notable companies such as Intel Corporation and Greenvity Communications, Inc. His experience in these organizations has contributed to his expertise in integrated circuit technology and innovation.

Collaborations

Throughout his career, Rui Zhang has collaborated with talented individuals, including Yueli Liu and Qinglei Zhang. These collaborations have likely enhanced his work and led to further advancements in his field.

Conclusion

Rui Zhang is a distinguished inventor whose work in integrated circuit technology has resulted in multiple patents and significant contributions to the industry. His innovative approaches continue to influence the development of advanced electronic systems.