The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Dec. 20, 2021
Intel Corporation, Santa Clara, CA (US);
Mukund Ayalasomayajula, Chandler, AZ (US);
Dinesh Padmanabhan Ramalekshmi Thanu, Chandler, AZ (US);
Rui Zhang, Chandler, AZ (US);
Xiao Lu, Chandler, AZ (US);
Robert Nickerson, Chandler, AZ (US);
Patrick Neel Stover, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.