Chandler, AZ, United States of America

Mukund Ayalasomayajula

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mukund Ayalasomayajula. Retrieved from https://idiyas.com/inventor/mukund-ayalasomayajula

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mukund Ayalasomayajula: Innovator in Semiconductor Technology

Introduction

Mukund Ayalasomayajula is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Mukund holds a patent for a "Solder grid array for attachment of a die package." This invention involves a die package that comprises a substrate with a solder pad element, a semiconductor die coupled to the substrate, and a solder layer made of a first solder material. The first solder material has a first melting temperature, while an interconnect ball made of a second solder material is deposited on the solder layer, with the second solder material having a lower melting temperature than the first.

Career Highlights

Mukund Ayalasomayajula is currently employed at Intel Corporation, a leading company in the technology sector. His work at Intel has allowed him to be at the forefront of semiconductor innovations.

Collaborations

Some of Mukund's coworkers include Xiao Lu and Robert M Nickerson, who contribute to the collaborative environment at Intel Corporation.

Conclusion

Mukund Ayalasomayajula is a distinguished inventor whose work in semiconductor technology has led to valuable innovations. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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