This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Mukund Ayalasomayajula: Innovator in Semiconductor Technology
Introduction
Mukund Ayalasomayajula is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Mukund holds a patent for a "Solder grid array for attachment of a die package." This invention involves a die package that comprises a substrate with a solder pad element, a semiconductor die coupled to the substrate, and a solder layer made of a first solder material. The first solder material has a first melting temperature, while an interconnect ball made of a second solder material is deposited on the solder layer, with the second solder material having a lower melting temperature than the first.
Career Highlights
Mukund Ayalasomayajula is currently employed at Intel Corporation, a leading company in the technology sector. His work at Intel has allowed him to be at the forefront of semiconductor innovations.
Collaborations
Some of Mukund's coworkers include Xiao Lu and Robert M Nickerson, who contribute to the collaborative environment at Intel Corporation.
Conclusion
Mukund Ayalasomayajula is a distinguished inventor whose work in semiconductor technology has led to valuable innovations. His contributions continue to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
