Rui Niu

Title: The Innovative Contributions of Rui Niu

Introduction

Rui Niu is a prominent inventor based in Cupertino, CA, known for his significant contributions to semiconductor packaging technologies. With a total of 3 patents to his name, Niu has developed innovative methods that enhance the performance and reliability of electronic devices.

Latest Patents

One of Rui Niu's latest patents is titled "Methods and apparatus for a substrate core layer." This invention discloses a structure for a core layer of a substrate, which includes a molding compound encapsulating a die or multiple dies. The core layer features a dielectric layer on the surfaces of the molding compound and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. Additionally, a laser via can be formed similarly. Build-up layers can be assembled next to the core layer to create a substrate suitable for packaging dies.

Another notable patent is "Devices and methods for 2.5D interposers." This invention utilizes polyimide-based redistribution layers (RDLs) to minimize thermo-mechanical stress on conductive interconnections bonded to interposers in 2.5D semiconductor packaging configurations. The polyimide-based RDL is strategically placed on either the upper or lower face of an interposer. Furthermore, height differentials between laterally adjacent semiconductor dies can be reduced or eliminated by employing different diameter micro-bumps, varying height copper pillars, or a multi-tiered interposer to adjust the positioning of taller semiconductor dies relative to shorter ones.

Career Highlights

Rui Niu has worked with several notable companies throughout his career, including Future Wei Technologies, Inc. and Huawei Technologies Co., Limited. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Throughout his career, Niu has collaborated with talented individuals such as Anwar Mohammed and Haoyu Song. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Rui Niu's work in semiconductor packaging has made a significant impact on the industry. His innovative patents demonstrate his commitment to advancing technology and improving the performance of electronic devices.