Future Wei Technologies, Inc.

Huawei Technologies Co., Limited

Rui Niu

Anwar Mohammed

Weifeng Liu

Haoyu Song

Fei Yu

Cao Wei

A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

Methods and apparatus for a substrate core layer

Polyimide-based redistribution layers (RDLs) can be employed to reduce thermo-mechanical stress that is exerted on conductive interconnections bonded to interposers in 2.5 D semiconductor packaging configurations. The polyimide-based RDL is located on an upper or lower face of an interposer. Additionally, height differentials between laterally adjacent semiconductor dies in 2.5 D semiconductor packages can be reduced or eliminated by using different diameter micro-bumps, different height copper pillars, or a multi-tiered interposer to lower taller semiconductor dies in relation to shorter semiconductor dies.

Devices and methods for 2.5D interposers

A multi-die integrated circuit assembly includes an interposer substrate larger than the typical reticle size used in fabricating the 'active area' in which the through-silicon vias (TSVs) and interconnect conductors are formed in the interposer. At the same time, each of the dies has its external power/ground and I/O signal line connections concentrated into a smaller area of the die. The dies are disposed or mounted on the interposer such that these smaller areas (with the power/ground/IO connections) overlap with the active area of the interposer. In this configuration, a plurality of dies having a combined area substantially greater than the active area of the interposer can be mounted on the interposer (and take advantage of the active area for interconnections).

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Cupertino, CA, United States of America

Rui Niu