Gilroy, CA, United States of America

Ronilo Boja

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 17(Granted Patents)


Location History:

  • San Jose, CA (US) (2014)
  • Gilroy, CA (US) (2017 - 2021)

Company Filing History:


Years Active: 2014-2021

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6 patents (USPTO):

Title: The Innovative Journey of Ronilo Boja

Introduction

Ronilo Boja, an accomplished inventor hailing from Gilroy, California, has made significant contributions in the realm of technology with a portfolio that includes six patents. His inventions primarily revolve around advanced chip package designs, showcasing his prowess in creating innovative solutions that address industry challenges.

Latest Patents

Among his latest inventions, Ronilo has developed a chip package featuring a cover with a window. This unique design enables excellent resistance to warpage while allowing access to the internal volume of the chip package. The cover is thoughtfully constructed with a lower surface facing the integrated circuit die and features elongated windows that expose the internal components.

Additionally, Ronilo has invented a chip package assembly incorporating a composite stiffener. This assembly is engineered to enhance resistance to warpage without overburdening the package substrate. By utilizing a two-member composite stiffener with differing Young's moduli, Ronilo’s design optimizes structural integrity, providing reliability for integrated circuit applications.

Career Highlights

Throughout his career, Ronilo has worked with prominent technology companies, including Xilinx, Inc. and Nvidia Corporation. His experiences at these leading firms have undoubtedly shaped his innovative mindset and contributed to his impressive portfolio of patents.

Collaborations

Ronilo has collaborated with talented professionals such as Inderjit Singh and Abraham Fong Yee, further enhancing his innovative capabilities through shared knowledge and expertise. These collaborations have played a vital role in the successful development of his patented inventions.

Conclusion

Ronilo Boja’s journey as an inventor reflects his dedication to pushing the boundaries of technology. With six patents to his name, his innovative designs in chip packaging not only demonstrate technical ingenuity but also highlight his commitment to solving complex engineering challenges. As he continues to innovate, Ronilo stands as a prominent figure in the field of technology, inspiring the next generation of inventors.

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