Campbell, CA, United States of America

Robert W Rumsey


Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 38(Granted Patents)


Location History:

  • Campbell, CA (US) (2003 - 2007)
  • Saratoga, CA (US) (2005 - 2011)

Company Filing History:


Years Active: 2003-2011

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9 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Robert W. Rumsey

Introduction

Robert W. Rumsey is a notable inventor based in Campbell, California. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work has focused on improving chip-scale packaging and lithographic techniques, which are essential for modern electronics.

Latest Patents

One of Rumsey's latest patents is a chip-scale package conversion technique for dies. This method describes how to convert an existing die, originally designed for a non-chip-scale package, into a chip-scale package die. The process involves shifting the die's layout relative to a grid of candidate positions for bonding pads until an optimal alignment is found. The bonding pad positions are then selected based on this alignment, and the die is fabricated using both original and new masks. This innovation allows for efficient bonding of the chip-scale package to a PCB using advanced technology.

Another significant patent is the box-in-box field-to-field alignment structure. This lithographic pattern includes scribes along the edges of a die region, featuring translucent and opaque boxes. When the pattern is stepped between fields on a wafer, the alignment is achieved by placing the translucent boxes within the opaque boxes. This technique enhances the precision of field alignment, which is crucial for high-quality semiconductor manufacturing.

Career Highlights

Robert W. Rumsey has spent a considerable part of his career at Micrel, Incorporated, where he has been instrumental in developing innovative semiconductor solutions. His expertise in chip-scale packaging and lithography has positioned him as a key figure in the industry. His contributions have not only advanced technology but have also paved the way for future innovations in semiconductor design.

Collaborations

Throughout his career, Rumsey has collaborated with several talented individuals, including Martin J. Alter and Martin E. Garnett. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the semiconductor field.

Conclusion

Robert W. Rumsey's work exemplifies the spirit of innovation in the semiconductor industry. His patents and contributions have significantly impacted the way electronic devices are designed and manufactured. His legacy continues to inspire future generations of inventors and engineers.

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