For the Inventor, By the Inventor

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Campbell, CA, United States of America

Robert W Rumsey

USPTO Granted Patents = 9

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 38(Granted Patents)

Location History:

Campbell, CA (US) (2003 - 2007)
Saratoga, CA (US) (2005 - 2011)

Company Filing History:

Micrel, Incorporated

Years Active: 2003-2011

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7979813 - Chip-scale package conversion technique for dies (2011-07-12),

2. 7273761 - Box-in-box field-to-field alignment structure (2007-09-25),

3. 7211893 - Integrating chip scale packaging metallization into integrated circuit die structures (2007-05-01),

4. 6984531 - Electrical field alignment vernier (2006-01-10),

5. 6900538 - Integrating chip scale packaging metallization into integrated circuit die structures (2005-05-31),

6. 6815128 - Box-in-box field-to-field alignment structure (2004-11-09),

7. 6762434 - Electrical print resolution test die (2004-07-13),

8. 6762432 - Electrical field alignment vernier (2004-07-13),

9. 6649932 - Electrical print resolution test die (2003-11-18),

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