San Jose, CA, United States of America

Robert W Hitzfeld


Average Co-Inventor Count = 5.8

ph-index = 5

Forward Citations = 192(Granted Patents)


Company Filing History:


Years Active: 1994-2005

where 'Filed Patents' based on already Granted Patents

7 patents (USPTO):

Title: Innovations of Robert W. Hitzfeld in Wafer Electroplating Technology

Introduction

Robert W. Hitzfeld, based in San Jose, California, is an accomplished inventor with a remarkable portfolio of seven patents. His innovations are primarily centered around systems and methods for enhancing wafer electroplating processes, making significant contributions to the field of semiconductor manufacturing.

Latest Patents

Among his latest inventions is a patented "Cathode current control system for a wafer electroplating apparatus." This system employs a current thief comprising a set of conductive segments that strategically surround the peripheral region of the wafer. The invention utilizes several resistance devices, each linked to a specific conductive segment to regulate the current during the electroplating process. These devices allow for precise control of current through both the conductive segments and additional conductive elements, known as fingers. Furthermore, the invention incorporates an automatic programming feature to select the resistance of each device, marking a significant advancement in the field.

Career Highlights

Robert W. Hitzfeld has worked with renowned companies in the industry, including IBM and Semitool, Inc. His experiences in these companies have enriched his knowledge and expertise in the semiconductor sector, enabling him to innovate and file multiple patents. His contributions have played a critical role in improving the efficiency and reliability of electroplating techniques used in modern technology.

Collaborations

Throughout his career, Hitzfeld has collaborated with notable professionals, including Joseph John Fatula, Jr. and Richard Jule Contreras. These partnerships have facilitated the development of innovative solutions that address complex challenges in wafer electroplating and semiconductor fabrication.

Conclusion

Robert W. Hitzfeld's contributions to the field of wafer electroplating technology highlight his role as a leading inventor within the semiconductor industry. Through his patented innovations, he has not only advanced the technology utilized in electroplating processes but has also demonstrated the importance of collaboration in driving significant advancements in this sector. His work continues to influence the efficiency of semiconductor manufacturing, paving the way for future innovations.

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