Robert W Batz, Jr

USPTO Granted Patents = 22 (Patent Applications = 2)

Average Co-Inventor Count = 4.4

ph-index = 7

Forward Citations = 144(Granted Patents)

Company Filing History:

Applied Materials, Inc.

patents

Years Active: 1999-2019

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22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10260855 - Electroplating tool with feedback of metal thickness distribution and correction (2019-04-16),

2. 9234293 - Electrolytic copper process using anion permeable barrier (2016-01-12),

3. 8961771 - Electrolytic process using cation permeable barrier (2015-02-24),

4. 8852417 - Electrolytic process using anion permeable barrier (2014-10-07),

5. 8236159 - Electrolytic process using cation permeable barrier (2012-08-07),

6. 8123926 - Electrolytic copper process using anion permeable barrier (2012-02-28),

7. 7252714 - Apparatus and method for thermally controlled processing of microelectronic workpieces (2007-08-07),

8. 7144805 - Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density (2006-12-05),

9. 7048841 - Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces (2006-05-23),

10. 6939448 - Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces (2005-09-06),

11. 6911127 - Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces (2005-06-28),

12. 6849167 - Electroplating reactor including back-side electrical contact apparatus (2005-02-01),

13. 6806186 - Submicron metallization using electrochemical deposition (2004-10-19),

14. 6805778 - Contact assembly for supplying power to workpieces during electrochemical processing (2004-10-19),

15. 6669834 - Method for high deposition rate solder electroplating on a microelectronic workpiece (2003-12-30),

Title: Robert W. Batz, Jr.: Innovating Electroplating Technologies

Introduction

Robert W. Batz, Jr. is a remarkable inventor based in Kalispell, MT, who has made significant contributions to the field of electroplating. With an impressive portfolio of 22 patents, he continues to push the boundaries of innovation in this technology sector.

Latest Patents

Among his latest patents is the "Electroplating tool with feedback of metal thickness distribution and correction". This advanced electroplating reactor features a unique configuration that allows a workpiece's front side to be immersed in an electroplating solution, while ensuring optimal metal thickness distribution through feedback control mechanisms connected to multiple anodes. Another notable patent is the "Electrolytic copper process using anion permeable barrier", which describes a process for electrolytically processing microfeature workpieces, ensuring precision and efficiency by utilizing an anion permeable barrier layer that effectively separates processing fluids.

Career Highlights

Throughout his career, Robert has demonstrated exceptional expertise in the field by working for notable companies such as Semitool, Inc. and Applied Materials, Inc. His tenure at these organizations has provided him with a robust platform to develop and refine his innovative ideas, leading to substantial advancements in electroplating technologies.

Collaborations

Robert has collaborated with talented individuals in his field, including coworkers like John Lee Klocke and Kyle Moran Hanson. Their collective efforts have strengthened the development and implementation of cutting-edge technologies, further enhancing the capabilities of the electroplating processes.

Conclusion

Robert W. Batz, Jr. stands as a prominent figure in electroplating innovation. His patents not only showcase his inventiveness but also contribute to the growth and advancement of the industry. The ongoing impact of his work will undoubtedly continue to shape future technologies in electroplating and beyond.

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