Robert Mamazza, Jr

Title: The Innovative Contributions of Robert Mamazza, Jr.

Introduction

Robert Mamazza, Jr. is a notable inventor based in Buchs, Switzerland. He has made significant contributions to the field of semiconductor technology, particularly in the deposition of nitride layers. With a total of 2 patents, his work has advanced the methods used in the production of high-quality semiconductor films.

Latest Patents

One of his latest patents is a method for depositing an aluminium nitride layer. This method involves providing a silicon substrate, placing it in a vacuum chamber, and conditioning the surface through etching. An aluminum film is then deposited onto the conditioned surface using a sputtering method in an Argon atmosphere, followed by the deposition of an epitaxial aluminium nitride layer in a Nitrogen and Argon atmosphere.

Another significant patent is for a method of depositing a Group III nitride semiconductor film. This process includes providing a sapphire substrate, conditioning its surface, and holding it at a predetermined distance from a heater while heating. The Group III nitride semiconductor film is deposited using a physical vapor deposition method, resulting in an epitaxial film with N-face polarity.

Career Highlights

Robert Mamazza, Jr. is currently employed at Evatec AG, a company known for its innovative solutions in the field of thin film deposition. His expertise in semiconductor technology has positioned him as a valuable asset to the company.

Collaborations

He has collaborated with notable coworkers such as Lorenzo Castaldi and Martin Kratzer, contributing to the advancement of their projects and innovations.

Conclusion

Robert Mamazza, Jr. continues to make impactful contributions to the field of semiconductor technology through his innovative patents and collaborative efforts. His work exemplifies the importance of advancements in the deposition methods of nitride layers, paving the way for future developments in the industry.