The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Dec. 15, 2014
Applicant:

Oerlikon Advanced Technologies Ag, Balzers, LI;

Inventors:

Lorenzo Castaldi, Galgenen, CH;

Martin Kratzer, Feldkirch, AT;

Heinz Felzer, Landquart, CH;

Robert Mamazza, Jr., Buchs, CH;

Assignee:

EVATEC AG, Trubbach, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/02 (2006.01); C23C 14/02 (2006.01); C23C 14/06 (2006.01); C23C 14/54 (2006.01); C30B 23/06 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02658 (2013.01); C23C 14/022 (2013.01); C23C 14/0617 (2013.01); C23C 14/541 (2013.01); C30B 23/063 (2013.01); C30B 29/403 (2013.01); H01L 21/0242 (2013.01); H01L 21/0254 (2013.01); H01L 21/02458 (2013.01); H01L 21/02609 (2013.01); H01L 21/02631 (2013.01); H01L 21/02661 (2013.01);
Abstract

A method for depositing a Group III nitride semiconductor film on a substrate is provided that comprises: providing a sapphire substrate; placing the substrate in a vacuum chamber; conditioning a surface of the substrate by etching and providing a conditioned surface; holding the substrate away from a substrate facing surface of a heater by a predetermined distance; heating the substrate to a temperature by using the heater whilst the substrate is held away from the substrate facing surface of the heater, and depositing a Group III nitride semiconductor film onto the conditioned surface of the substrate by a physical vapour deposition method whilst the substrate is held away from the substrate facing surface of the heater and forming an epitaxial Group III nitride semiconductor film with N-face polarity on the conditioned surface of the substrate.


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