This inventor holds 3 USPTO granted patents. Top assignee: Digital Equipment Corporation. Active years: 1989-1992.
Company Filing History:
Years Active: 1989-1992
Title: The Innovations of Robert J. Hannemann: Pioneering Semiconductor Packaging
Introduction: Robert J. Hannemann, based in Wellesley, MA, is a notable inventor recognized for his contributions to semiconductor packaging technology. With a total of three patents to his name, Hannemann has developed innovative solutions that enhance the efficiency and functionality of semiconductor chips.
Latest Patents: Hannemann's latest patents include two significant innovations in semiconductor packaging. The first is an "Integral Heatsink Semiconductor Package," which features an injection molded aluminum nitride heatsink that forms the substrate for an integrated heatsink package. In this design, a semiconductor chip is mounted directly onto the heatsink, enabling optimal heat dissipation. The heatsink’s planar surface supports a multilayer housing made from dielectric glass ceramic lamina and conductive circuit layers, creating a recessed cavity for the semiconductor chip. This design facilitates various electrical connection methods, such as wirebonding or tab tape, ensuring a robust and efficient thermal relationship between the chip and heatsink.
The second patent, the "Tape Automated Bonding Semiconductor Package," serves to protect a semiconductor chip, particularly a Very Large Scale Integration chip. In this patent, the chip is bonded to TAB tape, which has leads that connect it to an electrical circuit. The design includes a housing that encompasses the chip, while the leads project into the housing and bond to the chip, ensuring a reliable connection. This packaging innovation simplifies the assembly process and enhances circuit performance by maintaining a stable voltage reference.
Career Highlights: Robert J. Hannemann has spent a significant part of his career at Digital Equipment Corporation, where he has developed cutting-edge technologies that have influenced the electronics industry. His expertise in semiconductor packaging has made a lasting impact, positioning him as a prominent figure in the field.
Collaborations: Throughout his career, Hannemann has had the opportunity to collaborate with talented individuals, including notable coworkers Elric Saaski and Leslie R. Fox. These collaborations have further enriched his work, leading to advancements in semiconductor technologies that benefit various applications.
Conclusion: Robert J. Hannemann's innovative contributions to semiconductor packaging showcase his commitment to advancing technology in this critical field. Through his patents, he has not only improved the performance of semiconductor chips but has also paved the way for future developments within the industry. His work at Digital Equipment Corporation and collaborations with other experts underline the importance of teamwork and innovation in driving technological progress.