The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 1989
Filed:
Oct. 09, 1987
Elric Saaski, Kirkland, WA (US);
Robert J Hannemann, Wellesley, MA (US);
Leslie R Fox, Acton, MA (US);
Digital Equipment Corporation, Maynard, MA (US);
Abstract
An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface. The latent heat of vaporization is removed from the vapor so it recondenses and returns to the bottom of the module to repeat the heat transfer cycle. The wick's capillary pumping action keeps the fluid distributed over the top surface of the electronic component. The grooved top surface of the electronic component exposed to the wick cause an inverted liquid meniscus to be formed over the component. This causes the liquid adjacent the top of the component to readily evaporate.