Location History:
- Mount Vernon, TX (US) (1976)
- Essex Junction, VT (US) (2006 - 2009)
Company Filing History:
5 out of 164,221 
1 out of 832,891 Years Active: 1976-2009
Title: The Innovations of Robert F. White
Introduction
Robert F. White, an accomplished inventor based in Essex Junction, Vermont, has made significant contributions to the field of technology with a total of five patents to his name. His work primarily revolves around enhancing the reliability of electronic packaging, a critical aspect of modern computing.
Latest Patents
Among his latest innovations is the Patent for "Packaging Reliability Superchips," which is a sophisticated test chip module designed to assess the integrity of flip chip solder ball interconnections between the chip and substrate. This innovative testing mechanism employs a unique approach where individual heaters are used to thermally stress the interconnections. By providing a uniform source of heat, the module allows for the assessment of current flow through the interconnection to be tested. A voltage measuring circuit captures the voltage drop across the interconnection, allowing for the detection of stress-induced cracking and degradation. This breakthrough not only enhances the reliability of electronic components but also contributes to the longevity and performance of various technologies.
Career Highlights
Robert F. White is currently employed at the International Business Machines Corporation (IBM), a prestigious company known for its advancements in technological innovation. His role involves integrating his patented technologies into practical applications that support IBM's mission of leading in technology and innovation.
Collaborations
Throughout his career, Robert has collaborated with several talented individuals, including Jason E. Blanchet and James V. Crain, Jr. These partnerships have fostered an environment of innovation, enabling Robert to refine his inventions and contribute significantly to the technological landscape.
Conclusion
Robert F. White exemplifies the spirit of innovation through his dedicated work and patents, particularly in the realm of electronic packaging. His contributions not only improve the reliability of electronic systems but also pave the way for future advancements in technology, solidifying his legacy as a notable inventor in his field.