International Business Machines Corporation

Other

Robert F White

David Brian Stone

James V Crain, Jr

Charles W Griffin

Jason E Blanchet

Eric A Johnson

Irving Memis

William E Bernier

Son K Tran

Charles F Carey

Pierre M Langevin

Eberhard B Gramatzki

Thomas R Homa

Willie P Gossett

A test chip module for testing the integrity of the flp chip solder ball interconnections between chip and substrate. The interconnections, are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Packaging reliability superchips

A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Packaging reliability super chips

A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

Extension of fatigue life for C4 solder ball to chip connection

Disclosed is electrical plug ejecting apparatus having an elongated housing adapted to transversely retain the electrical plug, the housing defining a pair of spaced compartments disposed on opposite sides of the retained plug with ejector springs latchably retained within the compartments by trap doors tripably released by pivotal movement of a trip lever in response to the lateral movement of the line cord coupled to the electrical plug.

Electrical plug ejecting apparatus

Growing community of inventors

Essex Junction, VT, United States of America

Robert F White