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For the Inventor, By the Inventor

Endicott, NY, United States of America

Robert David Sebesta

USPTO Granted Patents = 22

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 367(Granted Patents)


Location History:

  • Endicott, NY (US) (1996 - 2006)
  • Edwards, CO (US) (2022)

Company Filing History:

goldMedal21 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 1996-2022

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22 patents (USPTO):
1. 11216775 - Digital luggage shipping system and method (2022-01-04),
2. 7098136 - Structure having flush circuit features and method of making (2006-08-29),
3. 7024764 - Method of making an electronic package (2006-04-11),
4. 6989297 - Variable thickness pads on a substrate surface (2006-01-24),
5. 6900545 - Variable thickness pads on a substrate surface (2005-05-31),
6. 6829823 - Method of making a multi-layered interconnect structure (2004-12-14),
7. 6815709 - Structure having flush circuitry features and method of making (2004-11-09),
8. 6618940 - Fine pitch circuitization with filled plated through holes (2003-09-16),
9. 6580494 - Method and system of distortion compensation in a projection imaging expose system (2003-06-17),
10. 6580491 - Apparatus and method for compensating for distortion of a printed circuit workpiece substrate (2003-06-17),
11. 6538213 - High density design for organic chip carriers (2003-03-25),
12. 6429113 - Method for connecting an electrical device to a circuit substrate (2002-08-06),
13. 6373717 - Electronic package with high density interconnect layer (2002-04-16),
14. 6351393 - Electronic package for electronic components and method of making same (2002-02-26),
15. 6291779 - Fine pitch circuitization with filled plated through holes (2001-09-18),

Title: The Innovation Journey of Inventor Robert David Sebesta

Introduction:

Robert David Sebesta, a brilliant mind in the field of technology and innovation, hails from Endicott, NY (US). With an impressive collection of 21 patents to his name, Sebesta has made significant contributions to the world of technology.

Latest Patents:

Among his latest patents is "Structure having flush circuit features and method of making," where Sebesta introduces embedded flush circuitry features by utilizing a carrier foil with an electrically conductive layer, coating it with a dielectric material, and forming circuitry features filled with conductive metal. Another notable patent is the "Method of making an electronic package," detailing a method for producing electronic packages with enhanced thermal conductivity and compliancy, crucial for the optimal performance of semiconductor chips.

Career Highlights:

Sebesta is an invaluable member of the International Business Machines Corporation (IBM), a renowned technology company known for its groundbreaking innovations in the industry. His expertise and dedication have led to the development of cutting-edge technologies that have pushed the boundaries of what is possible in the tech world.

Collaborations:

In his innovative journey, Sebesta has collaborated with esteemed colleagues such as Robert Lee Lewis and James Warren Wilson. Together, they have combined their skills and knowledge to create groundbreaking solutions and drive technological advancements in the industry.

Conclusion:

Robert David Sebesta's remarkable work in the field of technology and his extensive patent portfolio showcase his dedication to innovation and his commitment to pushing the boundaries of what is possible in the tech world. His contributions continue to inspire and pave the way for future innovations in the industry.

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