The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Feb. 18, 2000
Applicant:
Inventors:
Timothy F. Carden, Vestal, NY (US);
Todd W. Davies, Vestal, NY (US);
Ross W. Keesler, Endicott, NY (US);
Robert D. Sebesta, Endicott, NY (US);
David B. Stone, Burlington, VT (US);
Cheryl L. Tytran-Palomaki, Endicott, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
Abstract
An organic integrated circuit chip carrier for high density integrated circuit chip attach, wherein the contact pads or microvias which provide electrical interconnections to external circuitry are located in a first array pattern, while the plated through holes or through-vias are located in a second array pattern. This allows utilization of wiring channels within the chip carrier in which signal wiring traces can be routed.