Vestal, NY, United States of America

Timothy F Carden


Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 120(Granted Patents)


Company Filing History:


Years Active: 1989-2003

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7 patents (USPTO):

Title: The Innovative Mind of Timothy F. Carden

Introduction

Timothy F. Carden is a prominent inventor based in Vestal, NY, known for his significant contributions to the field of high-performance chip packaging. With a total of seven patents to his name, Carden's work focuses on developing advanced methods and materials that enhance the performance and reliability of electronic components.

Latest Patents

Among Carden's latest patents is a groundbreaking method of packaging a high-performance chip. This invention features a chip carrier package that includes a cover plate connected to a stiffener using a reflowable bonding material. Importantly, Carden's design allows for the inclusion of thermally and electrically conductive bonding material between the cover plate and the chip itself. Additionally, his innovation incorporates an alignment device to ensure the precise positioning of the cover plate on the stiffener. Another notable element of his method involves providing a reflowable material between the cover plate and the stiffener body for optimal attachment, which also facilitates the simultaneous connection of the carrier to an electronic circuit board. These advancements reflect Carden's commitment to improving chip packaging technology.

Career Highlights

Timothy F. Carden is currently employed at International Business Machines Corporation (IBM), one of the leading technology companies in the world. Throughout his career, Carden has focused on enhancing electronic device performance through his innovative packaging solutions, earning recognition for his technical expertise and inventive approach.

Collaborations

Carden has worked alongside skilled professionals, including Stephen R. Engle and Glenn O. Dearing. Their collaborative efforts exemplify the power of teamwork in driving forward the boundaries of innovation in the technology sector. Together, they have contributed to the development of cutting-edge solutions that address the complexities of modern electronics.

Conclusion

Timothy F. Carden represents the spirit of innovation in the field of technology, particularly in high-performance chip packaging. His inventive methods and dedication to improving electronic components ensure that he remains a key figure in the ongoing evolution of the industry. With a strong portfolio of patents and valuable collaborations, Carden continues to make his mark in the world of inventions.

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