Robert B Hallock

Title: The Innovations of Robert B Hallock

Introduction

Robert B Hallock is a notable inventor based in Newton, NH (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work has had a profound impact on the technology industry, particularly in the development of advanced packaging methods for semiconductor devices.

Latest Patents

Among his latest patents is a method for packaging semiconductors at a wafer level. This innovative package includes a dielectric layer on the surface portion of the semiconductor wafer, featuring a device exposing opening and an electrical contacts pad opening. Additionally, he has developed a flip chip mounted monolithic microwave integrated circuit (MMIC) structure. This structure is designed to be mounted to a circuit board with an underfill material and a barrier structure that prevents the underfill material from being disposed under an electronic device of the MMIC.

Career Highlights

Throughout his career, Robert has worked with prominent companies such as Raytheon Company and Raytheon. His expertise in semiconductor technology has positioned him as a leader in his field, contributing to various advancements in electronic device packaging.

Collaborations

Robert has collaborated with notable professionals in the industry, including John Michael Bedinger and Michael A Moore. These collaborations have further enhanced his innovative work and contributed to the success of his projects.

Conclusion

Robert B Hallock's contributions to semiconductor packaging and his impressive portfolio of patents highlight his role as a significant inventor in the technology sector. His work continues to influence advancements in electronic devices and semiconductor technology.