The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Dec. 20, 2011
Robert B. Hallock, Newton, NH (US);
William J. Davis, Hollis, NH (US);
Yiwen Zhang, Bedford, MA (US);
Ward G. Fillmore, Hudson, MA (US);
Susan C. Trulli, Lexington, MA (US);
Jason G. Milne, Hawthorne, CA (US);
Robert B. Hallock, Newton, NH (US);
William J. Davis, Hollis, NH (US);
Yiwen Zhang, Bedford, MA (US);
Ward G. Fillmore, Hudson, MA (US);
Susan C. Trulli, Lexington, MA (US);
Jason G. Milne, Hawthorne, CA (US);
Raytheon Company, Waltham, MA (US);
Abstract
A package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes: a dielectric layer disposed on the surface portion of the semiconductor wafer having a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad; and a porous material in the device exposing opening over said one of the devices.