Company Filing History:
Years Active: 2014
Title: Yiwen Zhang: Innovator in Semiconductor Packaging
Introduction
Yiwen Zhang is a prominent inventor based in Bedford, MA (US). She has made significant contributions to the field of semiconductor technology. Her innovative approach has led to the development of a unique method for packaging semiconductors at a wafer level.
Latest Patents
Yiwen Zhang holds 1 patent for her invention titled "Method for packaging semiconductors at a wafer level." This patent describes a package and method for packaging a semiconductor device formed in a surface portion of a semiconductor wafer. The package includes a dielectric layer disposed on the surface portion of the semiconductor wafer, which has a device exposing opening to expose one of the devices and an electrical contacts pad opening to expose an electrical contact pad. Additionally, a porous material is placed in the device exposing opening over the device.
Career Highlights
Yiwen Zhang is currently employed at Raytheon Company, where she continues to push the boundaries of semiconductor technology. Her work has been instrumental in advancing the efficiency and effectiveness of semiconductor packaging methods.
Collaborations
Some of her notable coworkers include Robert B Hallock and William J Davis, who have collaborated with her on various projects within the company.
Conclusion
Yiwen Zhang's contributions to semiconductor packaging demonstrate her innovative spirit and dedication to advancing technology. Her work not only enhances the field but also sets a precedent for future developments in semiconductor applications.