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For the Inventor, By the Inventor

Brecksville, OH, United States of America

Robert A Shick

This inventor holds 26 USPTO granted patents and 4 EPO patents, primarily in Polycyclic Polymer Compositions. Top assignees: Promerus, Lcc, The B. F. Goodrich Company, Sumitomo Bakelite Company Limited. Active years: 1999-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert A Shick. Retrieved from https://idiyas.com/inventor/robert-a-shick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26

% Patents Active = 76.9

 

Average Co-Inventor Count = 6.3

ph-index = 10

Forward Citations = 359(Granted Patents)


Location History:

  • Strongsville, OH (US) (1999 - 2010)
  • Brecksville, OH (US) (2011 - 2016)

Company Filing History:

goldMedal12 out of 164 
 
Promerus, Lcc
 patents
silverMedal7 out of 1,484 
 
The B. F. Goodrich Company
 patents
bronzeMedal4 out of 615 
 
Sumitomo Bakelite Company Limited
 patents
4. 1 out of 166,351 
 
International Business Machines Corporation
 patents
5. 3 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1999-2016

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Areas of Expertise:
Chip Stacking
Wafer Bonding
Polycyclic Polymers
Photosensitive Compositions
Optical Waveguides
Photoresist Compositions
Dielectric Resin
Polymer Alloys
Sacrificial Polymers
Acid Labile Groups
Etch Resistance
26 patents (USPTO):Explore Patents
1. 9263416 - Methods and materials useful for chip stacking, chip and wafer bonding (2016-02-16),
2. 8816485 - Methods and materials useful for chip stacking, chip and wafer bonding (2014-08-26),
3. 8729215 - Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers (2014-05-20),
4. 8575297 - Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers (2013-11-05),
5. 8120168 - Methods and materials useful for chip stacking, chip and wafer bonding (2012-02-21),
6. 8053515 - Directly photodefinable polymer compositions and methods thereof (2011-11-08),
7. 8030425 - Photosensitive compositions based on polycyclic polymers for low stress, high temperature films (2011-10-04),
8. 7932161 - Methods and materials useful for chip stacking, chip and wafer bonding (2011-04-26),
9. 7858721 - Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films (2010-12-28),
10. 7851575 - Polycyclic polymers containing pendant ion conducting moieties (2010-12-14),
11. 7524594 - Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films (2009-04-28),
12. 7378456 - Directly photodefinable polymer compositions and methods thereof (2008-05-27),
13. 7312292 - Polycyclic polymers containing pendant ion conducting moieties (2007-12-25),
14. 6790579 - Photoresist compositions comprising polycyclic polymers with acid labile pendant groups (2004-09-14),
15. 6723486 - Photoresist compositions comprising polycyclic polymers with acid labile pendant groups (2004-04-20),

Title: Robert A. Shick - Innovator in Chip Stacking and Bonding Technologies

Introduction

Robert A. Shick is a prominent inventor based in Brecksville, Ohio, with a remarkable portfolio of 26 patents. His innovations primarily revolve around methods and materials for chip stacking and wafer bonding, contributing significantly to advancements in semiconductor technology.

Latest Patents

Shick's latest patents focus on innovative methods and materials useful for chip stacking, as well as chip and wafer bonding. These patents disclose materials and techniques that enable the formation of strong bonds necessary for chip stacks, wafer bonding, and wafer thinning. Notably, the methods he developed ensure strong adhesion while allowing for easy removal with minimal to no residues, a crucial requirement in the electronics industry.

Career Highlights

Throughout his career, Robert A. Shick has made impactful contributions while working with leading companies in the technology sector. He has been associated with Promerus LLC and The B. F. Goodrich Company, where he applied his expertise to drive innovation and enhance product performance.

Collaborations

Shick has collaborated with notable professionals in the field, including Saikumar Jayaraman and Larry Funderburk Rhodes. These partnerships have facilitated the development of cutting-edge solutions in the realm of chip stacking and bonding technologies.

Conclusion

Robert A. Shick's extensive experience and significant contributions to the field of semiconductor technology are evidenced by his 26 patents. His latest innovations continue to push the boundaries of what is possible, ensuring the efficiency and effectiveness of chip stacking and bonding processes. His work remains a valuable asset to the industry and inspires future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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