Brecksville, OH, United States of America

Robert A Shick


 

Average Co-Inventor Count = 6.3

ph-index = 10

Forward Citations = 358(Granted Patents)


Location History:

  • Strongsville, OH (US) (1999 - 2010)
  • Brecksville, OH (US) (2011 - 2016)

Company Filing History:


Years Active: 1999-2016

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26 patents (USPTO):

Title: Robert A. Shick - Innovator in Chip Stacking and Bonding Technologies

Introduction

Robert A. Shick is a prominent inventor based in Brecksville, Ohio, with a remarkable portfolio of 26 patents. His innovations primarily revolve around methods and materials for chip stacking and wafer bonding, contributing significantly to advancements in semiconductor technology.

Latest Patents

Shick's latest patents focus on innovative methods and materials useful for chip stacking, as well as chip and wafer bonding. These patents disclose materials and techniques that enable the formation of strong bonds necessary for chip stacks, wafer bonding, and wafer thinning. Notably, the methods he developed ensure strong adhesion while allowing for easy removal with minimal to no residues, a crucial requirement in the electronics industry.

Career Highlights

Throughout his career, Robert A. Shick has made impactful contributions while working with leading companies in the technology sector. He has been associated with Promerus LLC and The B. F. Goodrich Company, where he applied his expertise to drive innovation and enhance product performance.

Collaborations

Shick has collaborated with notable professionals in the field, including Saikumar Jayaraman and Larry Funderburk Rhodes. These partnerships have facilitated the development of cutting-edge solutions in the realm of chip stacking and bonding technologies.

Conclusion

Robert A. Shick's extensive experience and significant contributions to the field of semiconductor technology are evidenced by his 26 patents. His latest innovations continue to push the boundaries of what is possible, ensuring the efficiency and effectiveness of chip stacking and bonding processes. His work remains a valuable asset to the industry and inspires future advancements.

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