1. Promerus, Lcc (12 from 160 patents)

2. The B. F. Goodrich Company (7 from 1,484 patents)

3. Sumitomo Bakelite Company Limited (4 from 612 patents)

4. Other (3 from 832,680 patents)

5. International Business Machines Corporation (1 from 164,108 patents)

6. Ravikiran, Ramakrishna (0 patent)

1. 9263416 - Methods and materials useful for chip stacking, chip and wafer bonding

2. 8816485 - Methods and materials useful for chip stacking, chip and wafer bonding

3. 8729215 - Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers

4. 8575297 - Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers

5. 8120168 - Methods and materials useful for chip stacking, chip and wafer bonding

6. 8053515 - Directly photodefinable polymer compositions and methods thereof

7. 8030425 - Photosensitive compositions based on polycyclic polymers for low stress, high temperature films

8. 7932161 - Methods and materials useful for chip stacking, chip and wafer bonding

9. 7858721 - Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films

10. 7851575 - Polycyclic polymers containing pendant ion conducting moieties

11. 7524594 - Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films

12. 7378456 - Directly photodefinable polymer compositions and methods thereof

13. 7312292 - Polycyclic polymers containing pendant ion conducting moieties

14. 6790579 - Photoresist compositions comprising polycyclic polymers with acid labile pendant groups

15. 6723486 - Photoresist compositions comprising polycyclic polymers with acid labile pendant groups