The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jan. 18, 2012
Applicants:
Chris Apanius, Moreland Hills, OH (US);
Robert A. Shick, Brecksville, OH (US);
Hendra NG, Highland Heights, OH (US);
Andrew Bell, Lakewood, OH (US);
Wei Zhang, Brecksville, OH (US);
Phil Neal, Wakeman, OH (US);
Inventors:
Chris Apanius, Moreland Hills, OH (US);
Robert A. Shick, Brecksville, OH (US);
Hendra Ng, Highland Heights, OH (US);
Andrew Bell, Lakewood, OH (US);
Wei Zhang, Brecksville, OH (US);
Phil Neal, Wakeman, OH (US);
Assignee:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 25/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/06517 (2013.01); H01L 27/14683 (2013.01); H01L 2924/01025 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/10253 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/01019 (2013.01); H01L 27/14618 (2013.01); H01L 2224/48227 (2013.01);
Abstract
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.