The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Jul. 01, 2005
Dino Amoroso, Medina, OH (US);
Brian Bedwell, Brecksville, OH (US);
Andrew Bell, Lakewood, OH (US);
Edmund Elce, Lakewood, OH (US);
Rajesh Raja Puthenkovilakom, North Royalton, OH (US);
Ramakrishna Ravikiran, Strongsville, OH (US);
Robert Shick, Strongsville, OH (US);
Xiaoming Wu, Strongsville, OH (US);
Hiroaki Makabe, Tokyo, JP;
Yasunori Takahashi, Tokyo, JP;
Etsu Takeuchi, Tokyo, JP;
Daoji Gan, Indianapolis, IN (US);
Seok Ho Kang, Marlborough, MA (US);
Dino Amoroso, Medina, OH (US);
Brian Bedwell, Brecksville, OH (US);
Andrew Bell, Lakewood, OH (US);
Edmund Elce, Lakewood, OH (US);
Rajesh Raja Puthenkovilakom, North Royalton, OH (US);
Ramakrishna Ravikiran, Strongsville, OH (US);
Robert Shick, Strongsville, OH (US);
Xiaoming Wu, Strongsville, OH (US);
Hiroaki Makabe, Tokyo, JP;
Yasunori Takahashi, Tokyo, JP;
Etsu Takeuchi, Tokyo, JP;
Daoji Gan, Indianapolis, IN (US);
Seok Ho Kang, Marlborough, MA (US);
Promerus LLC, Brecksville, OH (US);
Abstract
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.